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Description

Silver Conductive EpoxyDESCRIPTION Strong, highly conductive epoxy for solderless connections and repairs of circuit boards, static discharge shielding, grounding and conductive paths. Cure Schedule (Minimum bond temperature time) 65 to 121C (150 to 250F) for 5 to 10 min. 25C (75F) for 4 hours General Properties Bonding surface mount components High strength conductive bonds Quick, low or no heat cure air dries Rework or remove with hot soldering iron Excellent electrical

The adhesive is offered in a roll form and is black

PDMS Gel Sample

enabling imaging of the fragile biological samples without deforming the samples’ fundamental atomic structures

Tappingmode

3e-13 EMU (low)

Regular Bar

optionally

Requires specialized probe holder model VITA-CH-IN when used withInnova/Caliber AFMs

8 ea of the Ø15mm AFM discs

Transmission 45%

25/vial Mesh: 200

These O-rings are identical to FCO-10 except constructed of fluorosilicone rubber